LitePlacer.com forums

Hi again,

on that small board I spoke about there are regions packed with 0402 components (resistors and ceramics, so no same height) and I anticipate some difficulties with needle to components interference:
* too small there might be some pb with component release : with the purple needle the 0402s almost always stick to the needle. Ok no solder paste as these are the first attempts, but still...
* too big, it might interfere with its previously placed neighbourg (board density is OK for industrial P&P machines).

So I'd like to know what your experience is and which needle do you use/recommend for which components size. (have found no info on this)

Any other word of wisdom about this is welcomed too.

Thanks,
Fred

In real use, the stickiness of the paste releases the parts. (For experimenting, I often use a color laser printed image of the circuit board. I have the equivalent of post-it glue in a spray can; I attach the paper to a black PCB with that and spray glue on the top side as well to simulate paste stickiness.)

I use as big nozzle as possible as I can for best vacuum grip, but my boards, although sometimes dense, are not dense enough to get issues from nearby parts.